Project: Micromechanical characterization of low dielectric thin films involving polysilsequioxane and its copolymers

My main research emphasis will be placed on the quantitative study of the mechanical properties of nanoporous low dielectric thin films. I will study the relationship between the morphology and structure of nanoporous thin films and the mechanical properties such as elastic modulus, hardness and fracture toughness. I would also like to study the mechanical behaviors of organic/inorganic nanolaminates prepared by the spin-self assembly method our research group recently suggested. Using the spin self-assembly method, highly ordered organic/inorganic multiplayer films were shows to be prepared with expected improvement of fracture toughness.